Recommended Land Pattern
BGA Routing Scheme
Outline of Substrate
.005 Inch
Wide Traces
PCB Pad Diameter
Solder Mask Dia = Pad
Diameter +.15mm (.006 inch)
1.00mm Pitch (B7) = 0.51mm/.020 inch (minimum)
For .006" Thick Solder Paste Stencil, Aperture Opening Should
be Equal to the PCB Pad Diameter.
Refer to www.ctscorp.com/components/clearone.asp for
additional PCB design information
Top Side Probe-able Information
Top Side Probe-able Probe
Pad 4x8 Array Shown
Refer to Top Probe-able
Application Notes for additional
information.
Note: Add a ‘P’ suffix to order Top Side Probe-able version.
Example: RT1201B7PTR7.
Refer to the following link for detailed Top Side Probe-able Information:
www.ctscorp.com/components/clearone/TopProveClearOne.pdf
Mechanical Diagram
L
H
W
RT_20_B7
CTS YRWK
A1 Identifier
P (Pitch)
K
P (Pitch)
D
1.00 mm Pitch
L
W
H
P
D
K
RT1200B7
RT2200B7
RT1201B7
RT2201B7
mm
inch
mm
inch
8.00 ± 0.15
.315 ± .006
16.00 ± 0.15
.630 ± .006
4.00 ± 0.15
.157 ± .006
4.00 ± 0.15
.157 ± .006
1.19 ± 0.15
.047 ± .006
1.19 ± 0.15
.047 ± .006
1.00 ± 0.25
.039 ± .010
1.00 ± 0.25
.039 ± .010
0.64 ± 0.05
.025 ± .002
0.64 ± 0.05
.025 ± .002
0.50 ± 0.25
.020 ± .010
0.50 ± 0.25
.020 ± .010
Complete ClearONE Product, Processing, and Application Information can be found at the following link:
http://www.ctscorp.com/components/clearone.asp
? 2006 CTS Corporation. All rights reserved. Information subject to change.
CTS Electronic Components
www.ctscorp.com
Page 2
CompactPCI Terminator
March 06
相关PDF资料
RT1211B7TR7 RES NET 220 OHM 8 RES 24-TBGA
RT1236B7 RES ARRAY 100 OHM 32 RES 64-BGA
RT1250B7TR7 RES NET MULT OHM 16 RES 24-TBGA
RT1300B6PTR7 RES NET MULT OHM 27 RES 36-LBGA
RT1405B7PTR7 RES ARRAY 22 OHM 18 RES 36-TBGA
RT1418B7TR7 RES ARRAY 8.2K OHM 16 RES 24TBGA
RT1452B6TR7 RES NET 25 OHM 32 RES 36-LBGA
RT1710B6PTR7 RES NET 100 OHM 16 RES 32-LBGA
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